The HiSilicon Kirin 930 has 8 cores with 8 threads and is based on the 3. gen of the HiSilicon Kirin series. The processor was released in Q1/2015.
CPU lineage
The segment in which we have classified the HiSilicon Kirin 930. Here you can see if it is a desktop processor or a mobile processor or which processor may be the successor of the HiSilicon Kirin 930.
The HiSilicon Kirin 930 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 930 is 2.00 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
CPU Cores / Threads:
8 / 8
Core architecture:
hybrid (big.LITTLE)
A-Core:
4x Cortex-A53
B-Core:
4x Cortex-A53
Hyperthreading / SMT:
No
Overclocking:
No
A-Core Frequency:
2.00 GHz
B-Core Frequency:
1.50 GHz
Artificial Intelligence and Machine Learning
Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.
AI hardware:
--
AI specifications:
--
Internal Graphics
The HiSilicon Kirin 930 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 930 uses the ARM Mali-T628 MP4, which has 64 texture shaders and 4 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit):
No
h265 / HEVC (10 bit):
No
h264:
Decode / Encode
VP8:
Decode / Encode
VP9:
No
AV1:
No
AVC:
No
VC-1:
No
JPEG:
No
Memory & PCIe
The processor can use up to memory in 2 (Dual Channel) memory channels. The maximum memory bandwidth is --. The memory type as well as the amount of memory can greatly affect the speed of the system.
Memory type:
Memory bandwidth:
LPDDR3-1600
--
Max. Memory:
Memory channels:
2 (Dual Channel)
ECC:
No
PCIe:
PCIe Bandwidth:
--
Thermal Management
The thermal design power (TDP for short) of the processor is . The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. The TDP usually gives a rough idea of the actual power consumption of the CPU.
TDP (PL1 / PBP):
TDP (PL2):
--
TDP up:
--
TDP down:
--
Tjunction max.:
--
Technical details
The HiSilicon Kirin 930 is made in 28 nm. The smaller the manufacturing process of a CPU, the more modern and energy-efficient it is. Overall, the processor has 0.00 MB cache. A large cache can greatly speed up the processor's speed in some cases such as games.
Technology:
28 nm
Chip design:
Chiplet
Socket:
--
L2-Cache:
--
L3-Cache:
--
AES-NI:
No
Operating systems:
Android
Virtualization:
None
Instruction set (ISA):
Armv8-A (64 bit)
ISA extensions:
--
Release date:
Q1/2015
Release price:
--
Part Number:
--
Documents:
--
HiSilicon Kirin 930 8C 8T @ 2.00 GHz
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Benchmark results
The benchmark results for the HiSilicon Kirin 930 have been carefully checked by us. We only publish benchmark results that have been created by us or that have been submitted by a visitor and then checked by a team member. All results are based on and fullfill our benchmark guidelines.
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.