HiSilicon Kirin 960 | Qualcomm Snapdragon 662 | |
CPU comparisonIn this CPU comparison, we compare the HiSilicon Kirin 960 and the Qualcomm Snapdragon 662 and use benchmarks to check which processor is faster.
We compare the HiSilicon Kirin 960 8 core processor released in Q4/2016 with the Qualcomm Snapdragon 662 which has 8 CPU cores and was introduced in Q1/2020. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 960 (2) | CPU group | Qualcomm Snapdragon 662/665 (2) |
5 | Generation | 7 |
Cortex-A73 / Cortex-A53 | Architecture | Kryo 260 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 960 is a 8 core processor with a clock frequency of 2.40 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 662 clocks with 2.00 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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HiSilicon Kirin 960 | Characteristic | Qualcomm Snapdragon 662 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 4x Cortex-A73 |
A-Core | 2.00 GHz 4x Kryo 260 Gold |
1.80 GHz 4x Cortex-A53 |
B-Core | 1.80 GHz 4x Kryo 260 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 960 | Characteristic | Qualcomm Snapdragon 662 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 683 |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-G71 MP8 | GPU | Qualcomm Adreno 610 |
0.90 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Bifrost 1 | GPU Generation | 6 |
16 nm | Technology | 11 nm |
2 | Max. displays | 0 |
8 | Compute units | -- |
256 | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
2 GB | Max. GPU Memory | 4 GB |
11 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G71 MP8 | GPU | Qualcomm Adreno 610 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
No | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 6 GB of memory in a maximum of 2 memory channels is supported by the HiSilicon Kirin 960, while the Qualcomm Snapdragon 662 supports a maximum of 8 GB of memory with a maximum memory bandwidth of 29.8 GB/s enabled. |
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HiSilicon Kirin 960 | Characteristic | Qualcomm Snapdragon 662 |
LPDDR4-1600 | Memory | LPDDR4X-3733, LPDDR3-1866 |
6 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
12.8 GB/s | Max. Bandwidth | 29.8 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
4.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe HiSilicon Kirin 960 has a TDP of 5 W. The TDP of the Qualcomm Snapdragon 662 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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HiSilicon Kirin 960 | Characteristic | Qualcomm Snapdragon 662 |
5 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 960 has 4.00 MB cache and is manufactured in 16 nm. The cache of Qualcomm Snapdragon 662 is at 0.00 MB. The processor is manufactured in 11 nm. |
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HiSilicon Kirin 960 | Characteristic | Qualcomm Snapdragon 662 |
16 nm | Technology | 11 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2016 | Release date | Q1/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
ARM Mali-G71 MP8 @ 0.90 GHz |
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Qualcomm Snapdragon 662
Qualcomm Adreno 610 @ 0.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
Devices using this processor |
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HiSilicon Kirin 960 | Qualcomm Snapdragon 662 |
Huawei Honor 8 Pro Huawei Honor 9 Huawei Mate 9 Huawei Mate 9 Pro Huawei Mate 9 Porsche Huawei MediaPad M5 Huawei Nova 2s Huawei P10 |
Unknown |